SERVICES


ODM Solutions

With our innovative design, testing and manufacturing capabilities, professional PCBA design, OS porting, firmware design, we can offer you a total solution from start to finish. Furthermore, our abundant experience in this field, completed quality control and cost control system make sure that SmartComm is one of your best choices for partnership.

For accelerating the process, closely cooperation is necessary, and please note the details for the stages of the ODM procedure:

Step1
Discuss on the basis of OEM contract such as the responsibility of both sides and make an agreement with deposit.

Step2
According to the above procedure, We will prepare a total solution of the product development for the customer, including the product technical data, ID solution, development schedule, test plan, package etc. and build the sample after customers confirmation.

Step3
Send the sample including the package to our customer for confirmation.

Step4
After customer's confirmation it is the time to finalize everything and sign the formal ODM contract.

Step5
For the Customer, he/she begins to pay the down payment and deposits the left in a limited time or the customer can deposit the payment of the order one time. It is up to the customer. For us, we must produce the goods strictly according to customer's requirements.

Embedded computer R&D

We can provide professional embedded computer design including:
  • Electronics hardware design
  • OS Porting, Device Driver Development (Windows CE/Mobile, Android, Embedded Linux)
  • Software development, Application Development (Windows CE/Mobile, Android, Embedded Linux)
  • Mechanical design and modeling
  • System integration
  • Regulatory compliance
  • Reliability and environmental testing


CPU module

CM100-CORE CPU Module is designed and released in Dec 2010, this CPU module build-in power supply circuits, crystal oscillator, DDR2 SDRAM, NandFlash and Telechips high performance ARM11 CPU: TCC8900, it also can compatible with TCC8902 and TCC8901. CM100-CORE CPU CORE has high performance and good quality; it’s your good choice for embedded product design.

Features:
  • Total 240pin, 08mm pin pitch: 6 power supply pins, 32 GND pins and 202 signal pins, all high speed signal pins, include difference signal and clocks, are separated by GND for good signal EMI/EMC.
  • There are 3.0V, 1.8V and 1.42V power supply circuit build-in CPU Module to simplify the power supply circuits design in external main board, with carefully PCB layout for low power noise and low ripple.
  • The CPU Module also support external 1.8V and 1.42V power supply directly input, in case customer use PMIC solution in external main board.
  • CPU Module support CPU switch and run at 720MHz and 508MHz dynamically.
  • The default size of DDR2 SDRAM and NandFlash is 256MB, customer can order for other size.
  • CPU Module PCB is carefully designed, total 8 layers: 3 GND layers, one power layer, 4 signal layers, each signal layer have one GND layer companied, the bottom layer is GND layer, the top side will be covered with shield cover for best EMI/EMC performance.
  • The DDR2 SDRAM signals are good PCB Layout according to the DDR2 Layout rule to make the hardware stable and reliability.
  • The different signals of LVDS, HDMI, SATA and USB are carefully be layout according to high speed different signal Layout rule for good performance.
  • The 3 GND layers and shield cover can be used as good path for heat dissipation, the heat dissipation performance is very good.
  • The most difficult circuits of DDR2 SDRAM and power supply circuits are designed and PCB Layout in CPU Module, so the main board’s design will be simple and easy and make it easy to succeed at first time to save money.
  • 4 layers PCB design of main board is enough by using CPU Module, it will save main board’s BOM cost and speed up time to market, so the CPU Module is one product, which is worthy of confidence.
  • CM100-CORE CPU Module has powerful function, good performance, high extensibility and flexibility, good stable and reliability; it’s your good choice.
  • CM100-CORE CPU Module support Linux 2.6.28; Windows CE 6.0; Android 2.1 OS.

Hardware Specifications :

CPU
  • Telechips TCC8900, up to 720MHz@1.42V.
  • 65nm CMOS Process ARM1176JZF-S architecture processor.
  • Full HD (1920x1080) video decoding (H.264, MPEG 1/2, MPEG 4 , VC-1, Real Video 8/9/10, H.263).
  • 1280x720 video encoding (H.263, MPEG 4, H.264).
  • Support 2D/3D graphic acceleration (ARM’s Mali200) with Open VG 1.1 and Open GL ES 1.1/2.0, also support Overlay Mixer function.
  • Open OS Support: Linux 2.6.28, Windows CE 6.0 and Android 2.1.
  • CM100-CORE CPU Module also can support TCC8902 and TCC8901 chips
MEMORY
  • 256MB DDR2 SDRAM (32bit data bus)
  • 256MB NandFlash (8bit data bus, can support SLC & MLC)
  • Option for 2GB to 32GB
DIMENSIONS
  • 52mm(length) x 50mm(width) x 3mm(thickness) without shied cover
  • 52mm(length) x 50mm(width) x 4.5mm(thickness) with shied cover
PACKAGE
  • SMD type with half stamp holes on PCB quad side, total 240 pin, 0.8mm pin pitch.
  • This CPU module is designed and packaged to be processed in an automatic assembly line
OPERATION TEMPERATURE
  • Default: 0°C to 70°C，Can Support -40°C to 85°C if customer order
POWER SUPPLY
  • CPU’s IO, NandFlash and others: < 200mA@3.3V
  • CPU CORE: < 1.3W@(2.5V~5.5V) or < 800mA@1.42V (720MHz)
  • DDR2 SDRAM: < 1.2W@(2.5V~5.5V) or < 600mA@1.8V
  • CPU’s RTC (RTC Backup Battery): < 50uA@(1.8V~3.3V)
TARGET APPLICATION
  • STB, 3G Wireless DVR, Wireless WiFi Camera, PVR, PMP, Connected Portable Navigator, Car AV / AVN, Jukebox



Above istop side of CM100-CORE CPU Module with Shield Cover