It is a well known fact that the wave soldering for the printed circuit board manufacturer and for the other people involved in the large scale soldering business is a very important process. The people involved in this, make themselves well aware of every aspect of this process. Hence in order to help them, here is a glossary including some quite important terms and process from the process.

These terms and process glossary will help in knowing the wave soldering process more precisely.

Adhesive: - It is a Material used to clutch component in place during wave soldering or reflow soldering. It can be made a permanent part of the assembly or could be removed if wanted.

Blowhole: - Invalid waves solder connection fashioned by out gassing during the wave soldering process.

Chip-on-board Technology: - General term for a component assembling technology. In this, the silicon die is mounted directly on the printed wiring board.

Cold solder joint: - A wave solder link showing deprived wetting and a dirty, permeable look due to inadequate heat, not enough cleaning before the soldering, extreme impurity in the solder, and/or due to poor flux action.

Component: - A separate part or can say combination of parts which, collectively, carry outs a design function.

Component lead: - It is a stranded wire which performs both electrical and mechanical function, and is attached to the components.

Dewetting: - It is a condition which takes place when, molten solder has covered a surface and then withdrawn, it leaves erratically wrought mound of solder.

Dual-wave Soldering: - It is a specific type of wave soldering which uses turbulent wave with a consequent laminar wave.

Eutectic: - It is used for alloy of two metals which has a lower melting point as compared to either of its constituents.

Fault profile: - It is portrayal of the sort and frequency of the electrical defects most probably to be found on a populated PCB.

Flux: - It is a chemical or physical formation which is capable of keeping the solder wet.

Flux Residue: - They are the constituent part of flux substance residual on the PCB, subsequent to soldering and cooling.

Golden board: - It is used for a recognized high-quality PCB by which excellence of the boards manufactured may be compared while considering other PCBs for redrafting.

Infrared Reflow Soldering: - It is an infrared reflow soldering oven which uses the infrared rays as their primary source of heating.

Multilayer Board: - Is a printed circuit board which has more than two layers for the conductor routing. Internal layers and outer layers are connected by way of plated by means of holes.

Neutralizer: - Is an alkaline chemical which is added to the water in order to increase its ability to dissolve organic acid flux residues.

Outgassing: - Process of emission of the other gases form the PCB or from the solder joint.

: - It is the process of amalgamation of metallic surfaces through the mass heating of preplaced solder paste.

Solder: - it is a metallic alloy whose melting temperature is below 427'C (800F).

Soldering: - It is a process of joining metallic surfaces, without the melting of base materials, with solder.

Solder Flux: - A chemical formulation able to promote the wetting of metals with solder.

Wave Soldering: - A process of joining metallic surfaces with the help of molten solder into metallized areas without melting the base surface.

These are some important terms used in the wave soldering process. It will help all of you in understanding the process of wave soldering in a better way.